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So it turns out that recently GIGABYTE motherboards, in the name of which there is the word PRO, fall into my hands from time to time. In 2018, I authored reviews of such models as B450 AORUS PRO and Z390 AORUS PRO. And you know what? In both cases, we dealt with strong «workhorses» — boards that performed well in the «price — quality» coordinate system. So the heroine of today’s review — the GIGABYTE X570 AORUS PRO model — fits into the designated category.

GIGABYTE X570 AORUS PRO

⇡#Specifications and packaging

At the time of this writing, the official GIGABYTE website lists nine models of motherboards based on the new X570 chipset. At the same time, X570 AORUS PRO exists in two versions — if you need a device with a pre-installed wireless module, then look for an option called X570 AORUS PRO WIFI on sale. The rest of the versions are identical. The main technical characteristics of the device are shown in the table below.

GIGABYTE X570 AORUS PRO
Supported processors AMD Ryzen 3rd Generation
AMD Ryzen 2nd Generation
AMD Ryzen with Radeon Vega Graphics
Chipset AMD X570
Memory subsystem 4 × DIMM, up to 128 GB DDR4-2133-4400 (OC), for Ryzen 2000 up to DDR4-3600 (OC)
Expansion slots 3 x PCI Express x16
2 x PCI Express x1
Drive interfaces 1 × M.2 (Socket 3, 2242/2260/2280/22110) supporting SATA 6 Gb/s and PCI Express x4
1 × M.2 (Socket 3, 2242/2260/2280/22110) supporting SATA 6 Gb/s and PCI Express x4
6 x SATA 6Gb/s
RAID 0, 1, 10
The local network Intel I219V, 10/100/1000 Mbps
Audio subsystem Realtek ALC1220-VB 7.1 HD
Interfaces on the rear panel 1 x HDMI
1 x RJ-45
1 × optical S/PDIF
3 × USB 3.1 Gen1 Type A
1 x USB 3.1 Gen2 Type C
2 x USB 3.1 Gen2 Type A
4 x USB 2.0 Type A
5 × audio 3.5mm
Form factor ATX
Price 19 500 rub.

I’ll immediately note that you can read in detail about the X570 logic set in the article “AMD Ryzen 7 3700X processor review: Zen 2 in all its glory”, although further in the text the distinctive features of the new boards for the AM4 platform will be indicated.

The device is packaged in a small but colorful cardboard box. The packaging has a fairly recognizable appearance, but the main thing is, of course, its contents. In addition to the board itself, there were many accessories in it — both useful and not very useful:

  • user’s manual;
  • AORUS logo sticker;
  • disk with software and drivers;
  • four SATA cables;
  • screws for securing M.2 drives;
  • RGB strip extension;
  • G Connector adapter, which facilitates the connection of body controls.

In general, we have everything you need to immediately start assembling the system unit.

⇡#Design and features

So, we have an ATX form factor motherboard. In this case, the manufacturer uses a full-size printed circuit board, that is, its dimensions are 305 × 244 mm. Many people know what the use of textolite of a smaller area is fraught with. So, when the board is fixed in the case, its right side will bend and can be deformed when connecting RAM modules or the main connector of the power supply. In the case of the X570 AORUS PRO, unexpected «twists of fate» of this kind should not happen.

GIGABYTE X570 AORUS PRO

GIGABYTE X570 AORUS PRO: five PCI-E slots

Since we are talking about the ATX form factor, the manufacturer can place up to seven expansion slots on the board. However, the X570 AORUS PRO boasts only five PCI Express slots. In the photo above, we can see that some of the space is occupied by the M.2 ports required to install SSDs. Well, it’s definitely not worth worrying about.

The motherboard supports technologies such as AMD CrossFire (hardware manufacturers, like you and me, still use this term, although it is slowly becoming a thing of the past) and NVIDIA SLI. When two discrete devices are connected to the PCI Express x16 slots, they will work according to the x8 + x8 scheme. If you’ve read the Ryzen 7 3700X review, you know that we are now talking about the PCI Express 4.0 standard. Naturally, this will require a processor of the Ryzen 3000 family (only not the G-version, since it uses the now outdated Zen + architecture). In the case of the use of Ryzen 2000 «stones», all expansion slots will work according to the standard number 3.0.

The third PCI Express x16 port always works in x4 mode — these lines are provided directly by the chipset. They will also — depending on the generation of the Ryzen processor — work with either 4.0 or 3.0 throughput. And on the X570 AORUS PRO textolite there are two PCI Express x1 4.0 / 3.0 ports.

In my opinion, the location of the expansion slots on the test board turned out to be successful on the whole. First, the main PEG port is noticeably far from the processor socket. As a result, the X570 AORUS PRO will allow you to install any, even the largest air cooler. We can also install RAM modules without any problems without removing the video card.

Secondly, there is a decent distance between the main PEG ports — such that we can combine even video cards with three-slot coolers into SLI/CrossFire arrays. I believe that in 99.9% of cases the system will still use one graphics accelerator, and therefore we will have to say goodbye to one PCI Express x1 port. And one more thing: the video card will block the fan of the chipset cooling system, and the three-slot 3D accelerator will also lower the soldered M.2 slot.

I would like to draw your attention to the fact that the main PEG ports, as well as DIMM connectors, are reinforced. The ports also have additional fixation and an increased number of solder points on the PCB. In total, according to the manufacturer, such design solutions strengthen the connectors by 1.7 times under a fracture load and 3.2 times under a pull-out load.

When installing the LSS NZXT KRAKEN X62, I had to part with one DIMM slot — the one closest to the processor socket. This point must be taken into account if you want to assemble a system with a liquid cooling system of a similar design (when the dropsy hoses are attached to the water block on the right) and if you plan to install four RAM modules in the system.

The GIGABYTE X570 AORUS PRO has seven 4-pin fan headers. The board, traditionally for GIGABYTE products, allows you to control impellers with or without PWM (fans with 3-pin connectors). Thanks to Smart Fan 5 technology for this. Even fans up to 24W are supported. In general, the connectors for Carlsons are located well. I would only move the SYS_FAN5_PUMP connector, which is closest to the 24-pin power port, towards the processor socket. The fact is that by connecting a maintenance-free LSS pump to it, it is not so easy to hide the protruding wire. Still, I want to collect beautiful system blocks.

But the SYS_FAN6_PUMP connector is well located. It will come in handy if you are going to install a full-fledged custom «dropsy» on your PC. In a tower case, as a rule, the refrigerant tank and pump are attached to the front of it.

By the way, about beauty. On the top right of the X570 AORUS PRO, there are two ports for connecting LED strips at once: one is for a 12V RGB accessory, the second is for a 5V addressable strip. Exactly the same «sweet couple» is soldered at the bottom of the printed circuit board. Another 12V socket is located next to the AM4 socket. The cooler light is connected to it.

On the board itself, the left edge is highlighted, as well as a small strip on the plastic casing. I note that using the RGB Fusion 2.0 function, the user has the opportunity to set 11 glow modes.

The disk subsystem has six SATA 6 Gb / s ports and two M.2 slots. Now they do not share bandwidth with each other in any way. The main M.2 connector allows you to install SSD sizes 2242, 2260, 2280 and 22110. Both SATA and PCI Express modes are supported. The second option uses processor lines: in the case of Ryzen 3000, we are talking about the 4.0 standard, in the case of Ryzen 2000, about 3.0. The second M.2 slot has the same specifications, but in this case the PCI Express lanes come from the chipset.

In my opinion, the main M.2 port is well located. It will not be covered by a video card, and when using an air CPU cooler, the SSD installed in this slot will be additionally blown. But the additional M.2, it seems to me, was better to be soldered below the second PEG port — next to the PCI Express x1 and the chipset. With this arrangement, the SSD will not be (even partially) covered by the graphics card if only one graphics accelerator is used in the system. We can safely say that the era of NVMe drives has come in full — therefore, the presence of two M.2 SSDs in a PC at once does not look like something outlandish.

GIGABYTE X570 AORUS PRO is equipped with a high-quality Intel I219-V gigabit network controller and Realtek ALC1220-VB sound chip. The audio codec has a signal-to-noise ratio of 120 dB and an intelligent amplifier that automatically detects the impedance of the connected headphones. The manufacturer separately notes that the new controller allows high-quality voice transmission to the Network from a microphone connected to a 3.5 mm jack on the front or rear panel. In addition, the path is equipped with special WIMA FKP2 capacitors. Here we see a complete copy of the audio subsystem used in the AORUS B450 PRO.

On the GigX570 AORUS PRO I / O panel, you will find two USB 3.1 Gen2 A-type ports at once and another one of the same type, but C-type. Three more USB connectors comply with the 3.1 Gen1 standard, and four more are 2.0. Of the video outputs, there is only HDMI. The rest of the space on the rear panel is occupied by RJ-45, an optical S / PDIF-out and five 3.5 mm mini-jacks.

As for the internal I / O ports of the X570 AORUS PRO, one USB 3.1 Gen2, two USB 3.1 Gen1, two USB 2.0, TPM and F-audio are soldered along the edges of the PCB of the device.

Of the pleasant little things, I note the presence of the Q-Flash button on the board, with which the BIOS of the motherboard can be updated without even turning on the computer.

According to the manufacturer, the X570 AORUS PRO power converter has 12 + 2 phases — it sounds impressive, agree. The VRM lines are controlled by the Infineon IR35201 PWM controller, which, as you know, works according to the 6 + 2 scheme. This means that in reality the power subsystem of the X570 AORUS PRO, which is responsible for the operation of the computing cores, has six phases — they are just dual (on the reverse side we see Infineon IR3599 PWM backups). Each such channel includes two inductors and two Infineon IR3553 field-effect transistors, each of which can withstand a load of 40 A. Each of the two phases responsible for the operation of the SoC components of the processor consists of one inductor and four MOSFETs ON Semiconductor — two transistors 4C10N and 4C06N.

In general, the X570 AORUS PRO power converter inspires confidence. In addition, the field-effect transistors in it are cooled by two large aluminum radiators connected by a copper heat pipe. I will tell you in detail about the efficiency of the power converter of this board in the second part of the review.

Please note that the chipset of the device is cooled by an active cooler. We’ll get used to this state of affairs, because many X570 motherboards use a similar cooling system. The fact is that the level of heat dissipation of the logic set reaches 14 watts. As you know, AMD, in fact, uses a slightly modified I / O chip, which is used in EPYC Rome server processors. It is produced on a 14nm process and, as you can see, needs active cooling.

I have already noted that in some cases the fan of the chipset cooler will be covered by the video card. This leads to the fact that the chipset, if you use the temperature sensors of the board itself, heats up to 55-60 degrees Celsius. The fan itself is quite noisy only when the computer is turned on, and then a few seconds pass — and it ceases to be heard.

Of course, over time, the impeller will become clogged with dust and, possibly, will begin to make extraneous sounds. However, one must understand that its owner is entirely responsible for the «hygiene» of the system unit — do not be lazy to clean your PC from dust as often as possible.

⇡ # BIOS Features

With the advent of boards based on the X570 chipset, GIGABYTE has changed its UEFI BIOS quite noticeably. So, the MIT tab, which is responsible for overclocking functions, is a thing of the past. Now the overclocking options are located in the Tweaker menu. A new tab has also appeared — Favorites, which contains the most commonly used motherboard settings.

Let’s briefly list the main tabs of the updated UEFI BIOS:

  • Favorites — Shows the most commonly used board settings.
  • Tweaker — allows you to overclock the processor and RAM, as well as control the main voltages of the system.
  • Settings — contains settings for the chipset, as well as the SoC component of the processor.
  • System Info — tells about the current BIOS version, about the devices installed in the motherboard, and also gives access to the Q-Flash function.
  • Boot — here are the settings related to booting the system and connecting drives to the motherboard.
  • Save & Exit — the name of the tab speaks for itself.

The table below lists all the possible voltages that can be “steered” in the X570 AORUS PRO.

Min/Max value, V Step, B
CPU Vcore 0.75/1.8 0.01725
VCORE SOC 0.75/1.8 0.01725
CPU VDD18 1.6/2.32 0.02
PM_CLDO12 0.8/2 0.01
PM_1VSOC 0.8/1.5 0.02
PM_1V8 1.5/2 0.02
DRAM Voltage (CH A/B) 1/2 0.01
DDRVPP Voltage (CH /B) 1.98/3.02 0.04
DRAM Termination (CH A/B) 0.375/0.833 0.04

To be honest, at the time of this writing, I have already met some other motherboards based on the X570 chipset, and the GIGABYTE X570 AORUS PRO voltage set looks modest against their background. And yet, everything you need to overclock Ryzen chips at home is here. For extreme overclocking, obviously, completely different devices are on sale.

I note that the VCore voltage changes not only explicitly, but also in the Offset mode. We can deviate from the default by -0.3 to +0.3 V in 0.00625 V increments. And the X570 AORUS PRO has six levels of Load-Line Calibration — for both compute cores and SoCs. component.

As always, I am pleased with the huge number of temperature sensors in GIGABYTE boards. We can monitor the heating not only of the CPU, but also of the VRM, the chipset, both PEG ports, as well as the areas of the board located just below the chipset’s cooling system and just below the third PCI Express x16. Plus, two thermocouples can be connected to the board.

⇡ # Overclocking and stability

The table below shows a list of all components that were used during testing of the GIGABYTE X570 AORUS PRO. In particular, different processors were used.

Test bench configuration
CPU AMD Ryzen 7 2700X, 3.7 (4.3) GHz
AMD Ryzen 5 3600X 3.8 (4.4) GHz
Motherboard GIGABYTE X570 AORUS PRO (BIOS F4f)
RAM G.Skill Trident Z F4-3200C14D-32GTZ, DDR4-3200, 2×16 GB
Storage device Samsung 970 EVO, 1 TB
video card NVIDIA GeForce RTX 2080 Ti 11 GB GDDR6
Power Supply Corsair HX850i 850W
CPU cooler Noctua NH-D15
NZXT Kraken X62
Frame Open test bench
Monitor Acer S277HK 27″ Ultra HD
Operating system Windows 10 Pro x64 1903
Video card software
NVIDIA GeForce Game Ready Driver 430.86
Additional software
Uninstalling drivers Display Driver Uninstaller 17.0.6.1
Measuring FPS Fraps 3.5.99
FRAFS Bench Viewer
Action! 2.3.0
Overclocking and Monitoring GPU-Z 2.22.0
MSI Afterburner 4.6.0
Optional equipment
Thermal imager Fluke Ti400
Sound level meter Mastech MS6708
Wattmeter watts up? PRO

To more clearly demonstrate the positive effect of overclocking the CPU and RAM, the following benchmarks and games were launched on the test bench:

  • 3DMark Professional Edition 2.2.3509. Time Spy test, DirectX 12.
  • CINEBENCH R20. Performance measurement of photorealistic 3D rendering in CINEMA 4D animation package, CPU test.
  • x265 HD Benchmark. Testing the speed of video transcoding to the promising H.265/HEVC format.
  • Blender 2.80 RC1. Determination of the final rendering speed in one of the popular free packages for creating three-dimensional graphics. The duration of building the final model from Blender Cycles Benchmark rev4 is measured.
  • Adobe Premier Pro 2019. Project rendering in Ultra HD resolution.
  • Fritz 9 Chess Benchmarks. Testing the speed of a popular chess engine.
  • Corona 1.3. Testing rendering speed using the renderer of the same name. Measures the build speed of the standard BTR scene used to measure performance.
  • The Witcher III: Wild Hunt, Novigrad and surroundings. Full HD. Ultimate Quality Mode, NVIDIA HairWorks on, HBAO+, AA.
  • GTA V, built-in benchmark (last scene). Full HD. Max. quality, advanced quality settings — on, image resolution scaling — off, 16 × AF, FXAA + 4 × MSAA.
  • Battlefield V, The Last Tiger mission. Full HD, DirectX 12. Ultra mode, DXR off, TAA.

The manufacturer assures that when using third-generation Ryzen processors, RAM kits with an effective frequency of up to 4400 MHz can be used. At the same time, the list of supported RAM modules does include the following kits: G.Skill F4-4400C19D-16GTZSW and ADATA AX4U440038G19-QR80. It’s a pity that I didn’t have such equipment at hand — it would be very interesting to check this moment and study the performance of a system with such RAM. We know that the use of chiplets in the Ryzen 3000 has resulted in the processor core and memory controller being separated. Chiplets communicate with each other using the Infinity Fabric bus, which operates by default at a frequency of 1800 MHz. Yes, now this bus and RAM can operate at different frequencies, but the Infinity Fabric frequency must either be equal to the actual RAM frequency or less than it. The BIOS of the hero of today’s review allows you to change the frequency of Infinity Fabric, but in fact I could not increase it even by 33 MHz above the nominal value. When using RAM kits operating at an effective frequency above 3600 MHz, the memory controller clock generator starts to work in 2:1 mode, that is, its frequency is halved. All this means that the use of modules such as G.Skill F4-4400C19D-16GTZSW and ADATA AX4U440038G19-QR80 will most likely even harm system performance. A detailed article on this topic will be published on our website soon.

Overclocking Infinity Fabric, which is quite logical, depends on the central processor — there are Ryzen 3000 models that take 1900 MHz on this bus, but even in this case it is logical to use a DDR4-3800 RAM kit.

Our test rig used the G.Skill Trident Z F4-3200C14D-32GTZ kit. This is a rather «sluggish» memory, although it has low latency. At a voltage of 1.4 V, the RAM accelerates to an effective frequency of 3400 MHz while maintaining native timings. At the same time, on the AM4 platform in overclocking, the kit works stably only after disabling the Gear Down function.

Rated operating mode

Rated operating mode

As I said, two CPUs were used to test the GIGABYTE X570 AORUS PRO: Ryzen 5 3600X and Ryzen 7 2700X. Unfortunately, I didn’t have a 12-core Ryzen 9 at hand, but in fairness I’ll note that along with such a board, I think they will buy 6- or 8-core models more often when it comes to a gaming system.

In the screenshot above, we can see that when loading all six cores, the Ryzen 5 3600X frequency in Prime95 29.8 (Small FFTs subtest) does not drop below 4.09 GHz. At the same time, in my opinion, the chip is seriously heated — its temperature rises to 78.8 degrees Celsius. The peak power consumption of the entire system was 156 watts. We are once again convinced that together with the Ryzen 3000 chips — if you want them to work as fast as possible out of the box — you need to use the most efficient cooling.

CPU overclocking

CPU overclocking

Interestingly, overclocking the Ryzen 5 3600X on its own turned out to be almost useless. I was able to hit the Prime95 stable 4.24 GHz, but I had to set the VCore voltage to 1.45 V and turn on the High mode of the Load-Line Calibration function. Other attempts to achieve more efficient (both in terms of frequency and energy efficiency) results have failed. In this mode, the power consumption of the stand increased to 185 W, the maximum CPU heating was 99.5 degrees Celsius.

GIGABYTE X570 AORUS PRO power converter heating (Ryzen 5 3600X, nominal)

GIGABYTE X570 AORUS PRO power converter heating (Ryzen 5 3600X, nominal)
GIGABYTE X570 AORUS PRO power converter heating (Ryzen 5 3600X, overclocking)

GIGABYTE X570 AORUS PRO power converter heating (Ryzen 5 3600X, overclocking)

Personally, I think that there is no point in doing this in the case of the Ryzen 5 3600X — the evidence will be given in the next paragraph. And yet, we must admit that the GIGABYTE X570 AORUS PRO does its job well. The power converter, which is not additionally blown, does not overheat at all. And when using an air cooler, the temperatures of the VRM zones will be even lower.

By the way, comparing the images of the thermal imager with the HWiNFO64 indicators, we see that the VRM_MOS temperature sensor is not located at the hottest point in the power circuit, but its indicators can be trusted — the difference turns out to be small.

In games, the system feels much more comfortable. Thus, the temperature of the CPU does not rise above 56 degrees Celsius, and the power converter does not heat up to 60 degrees Celsius. Only the chipset is hot — it is obviously heated by the video card, and therefore its temperature rises to 60 degrees Celsius.

The BIOS of the motherboard allows you to fine-tune the Precision Boost 2 parameters in order to use this technology to make the CPU work even faster. However, in practice, I failed to squeeze at least another 100-150 MHz out of the Ryzen 5 3600.

Rated operating mode

Rated operating mode

By installing the Ryzen 7 2700X in the stand, we made life much more difficult for the X570 AORUS PRO. So, in Prime95, the system power consumption level increased to 180 watts. So the power converter began to warm up more — at its hottest point, the temperature jumped to 73 degrees Celsius.

CPU overclocking

CPU overclocking

Interestingly, I managed to overclock the Ryzen 7 2700X to 4.31 GHz. To do this, I had to increase its supply voltage to 1.4 V and turn on the LLC option in High mode. In this mode of operation, the power consumption of the stand in the Prime95 program increased from 180 to 241 W, and the maximum CPU temperature increased from 67.8 to 84.3 degrees Celsius. And again, a similar picture is observed: to achieve a meager increase in frequency, you have to pretty much overload the system.

GIGABYTE X570 AORUS PRO power converter heating (Ryzen 7 2700X, nominal)

GIGABYTE X570 AORUS PRO power converter heating (Ryzen 7 2700X, nominal)
GIGABYTE X570 AORUS PRO power converter heating (Ryzen 7 2700X, overclocking)

GIGABYTE X570 AORUS PRO power converter heating (Ryzen 7 2700X, overclocking)

Who will mock their PC like that? I think maximalists who want to squeeze all the juice out of their system. And also enthusiasts who want to thoroughly explore all the possibilities of computer technology used in everyday life.

It is important to note here that the X570 AORUS PRO is well suited for such experiments. We again see that the device’s power converter, even in conditions as close as possible to combat, does not overheat. Although I did not use the 12-core Ryzen 9 in the stand, I can already safely say that the X570 AORUS PRO will work perfectly with these processors in the nominal mode.

⇡#Performance

I fully agree with my colleague Ilya Gavrichenkov, who in his review of the Ryzen 7 3700X said: “The result obtained (from overclocking) is more of a theoretical value, and there is no point in resorting to such overclocking in practice. The increase in performance under multi-threaded load will be several percent — despite the fact that when the cores are not fully loaded, the processor will work even slower than in the nominal mode«. The evidence is shown in the graphs below.

⇡#Conclusions

In my opinion, GIGABYTE X570 AORUS PRO is a good board. Once again, we see that «Proshki» from GIGABYTE are distinguished by a successful combination of quality and cost. I have practically no complaints about the device. Yes, there are microscopic quibbles about the layout of some components, but these are just nitpicks. The board is all right in terms of functionality and, more importantly, reliability — at least there is no reason to be afraid for it. I think testing has clearly shown that the GIGABYTE X570 AORUS PRO will work great with both 8-core Ryzen chips and 12-core Ryzen 9 3900X. Which means I see no reason not to use it when building a really powerful gaming PC or workstation.

Yes, in the current realities, the price of $ 220 is considered average, since there are cheaper motherboards, and there are much more expensive ones. However, there is nothing surprising in this: you will not see cheap X570 boards on sale. Still, we are dealing with an advanced chipset for the AM4 platform.

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